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Helium氦气

He · CAS 7440-59-7 · UN 1046

High-purity helium — inert gas, widely used for MRI superconducting cooling, semiconductor manufacturing, helium leak detection, aerospace fuel pressurization.高纯氦气——惰性气体,广泛用于MRI超导冷却、半导体制造、氦质谱检漏、航空航天燃料增压。

Chemical Formula化学式He
CAS NumberCAS 号7440-59-7
UN NumberUN 编号UN 1046
Boiling Point (1 atm)沸点(1 atm)−268.94 °C
Packaging包装47L/50L steel cylinders, ISO tank on request
Purity Grade纯度等级≥99.999%

Product Quality Index产品质量指标

Helium Concentration(Volume Fraction)氦气浓度(体积分数)≥99.999%
Neon Content(Volume Fraction, ppm)氖含量(体积分数,ppm)<4
Hydrogen Content(Volume Fraction, ppm)氢含量(体积分数,ppm)<1
Oxygen+Argon Content(Volume Fraction, ppm)(氧气+氩气)含量(体积分数,ppm)<1
Nitrogen Content(Volume Fraction, ppm)氮含量(体积分数,ppm)<2
CO Content(Volume Fraction, ppm)CO含量(体积分数,ppm)<0.5
CO₂ Content(Volume Fraction, ppm)CO₂含量(体积分数,ppm)<0.5
Methane Content(Volume Fraction, ppm)甲烷含量(体积分数,ppm)<0.5
Water Content(Volume Fraction, ppm)水含量(体积分数,ppm)<3
Total Impurity Content(Volume Fraction, ppm)杂质总含量(体积分数,ppm)≤10

Physical Property物理性质

Component成分Helium氦气
Appearance and Character外观和性状Colorless, odorless inert gas无色无味的惰性气体
Melting Point (℃)熔点(℃)−272.2 ℃(2555kPa)
Boiling Point (℃)沸点(℃)−268.94 ℃
Relative Density (water=1)相对密度(水=1)0.15
Relative Vapor Density (air=1)相对蒸气密度(空气=1)0.14
Saturated Vapor Pressure饱和蒸汽压 202.64 kPa (-268 ℃) 202.64千帕(-268 ℃)
Critical Temperature (℃)临界温度(℃)−267.95 ℃
Critical Pressure (MPa)临界压力(MPa)0.23 MPa
Solubility溶解度Insoluble in water and ethanol不溶于水、乙醇

Main Use主要用途

Application用途Low-temperature superconductivity: cooling agent for MRI and particle accelerators. Semiconductor manufacturing: protective gas for photolithography and etching, carrier gas for wafer production. Leak detection: tracer gas for helium mass spectrometer leak detectors. Aerospace: rocket fuel pressurization and airship filling gas.低温超导:MRI核磁共振、粒子加速器冷却剂。半导体制造:光刻、刻蚀保护气,晶圆制造载气。检漏分析:氦质谱检漏仪示踪气体。航空航天:火箭燃料增压、飞艇填充气。

Packing Specification包装规格

Package包装47L/50L cylinders, ISO tank on request47L/50L气瓶,可按需提供ISO罐